Based on nano-silver technology, Kyocera s Silver Sinter Paste demonstrates a thermal conductivity of more than 200 W/mK, and excellent die-shear adhesion to bare copper and silver- and gold-plated surfaces. Compared to standard solders and electrically conductive die-attach pastes, Kyocera s Silver Sinter Paste offers more than three times the thermal conductivity. Moreover, through the utilization of a novel resin-dispersion system, the paste shows excellent interface reliability in the most demanding applications.
The semiconductor industry is making every effort to eliminate high-lead solder in its products, where feasible, due to environmental and health concerns. Many semiconductor devices serve essential safety purposes in automotive and industrial applications. Until now, high-lead alloys which offer a high melting point and thermal conductivity were considered necessary to guarantee the required level of reliability. By leveraging the unique properties of nano silver, Kyocera s solution to further enhance semiconductor performance offers a low-temperature, pressureless silver solder option that enhances the performance of high-power semiconductor devices, such as gallium nitride (GaN) and silicon carbide (SiC).
Kyocera is actively engaged in the development of environmentally friendly products and strives to reduce the use of environmentally-harmful materials and processes in the industries it supports.
CT2700 Silver Sintering Paste
Outstanding thermal conductivity 200W/mK
Outstanding electrical performance
Pressureless sintering capability
Outstanding interface reliability
Outstanding workability (dispensable)
Low temperature sintering capability
High power device such as IGBT modules
High performance LED packaging
Alternative for high Pb solder alloys